Noohapou Fundamentals Explained
Noohapou Fundamentals Explained
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The POU3500 program presents dynamic temperature Charge of the process chamber cathode / electrode / anode and may be synchronized with any etch process.
30% of its peak power consumption, giving our consumers major reduction in running prices and elevated trustworthiness.
the data below is categorized by semiconductor process and Instrument maker. Every single table contains an Applications Matrix that reveals qulified and professional procedures.
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LAUDA-Noah will, for the client's retrofit evaluation, keep track of and modify its fluid temperature Manage profiles to match an current TCUs' in order to guarantee a easy method read more integration through DAQ.
The accuracy with the POU 3300 permits independent control of the procedure fluid temperature towards the wafer chuck in +/- 0.one °C of set point, as well as quickly response time on the process permits for optimum wafer-to-wafer repeatability throughout the etch approach.
All static TCUs involve excess cooling & heating capacities because of their pretty substantial method fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature Management technique is lower than 1 gallon.
With our unit strategically mounted roughly 6 toes from the chamber, we obtain a way more correct reading through with the chuck temperature. This solution assures regular temperature through the output whole lot, bringing about improved wafer-to-wafer CD uniformity.
The data pertains to a 300mm chamber temperature profile throughout a superior element ratio Etch system, working at very high RF electrical power disorders (~3.8kW). The powerful aspects of this details established are:
LAUDA-Noah is Assembly these new difficulties and has included Strength preserving technology in devices which can be welcoming on the natural environment and possess a low cost to operate.
The TEs' can change directly from heating to cooling, or visa-versa. they might activate & off whilst during the heating or cooling method and can increase or reduce the amount of heating or cooling without having switching in any respect.
The POU3300 program delivers dynamic temperature control of the method chamber cathode / electrode / anode and can be synchronized with any etch method.
Confirmed; TEs' characterize only one Element of a chiller's style. The switching & Management solutions utilized by a chiller will impression the TEs' trustworthiness.
(Therefore, putting in a static unit beside chamber will never allow it to provide dynamic temperature control)
We call for a lot less cooling/heating capability for the same software being a static TCU because of our small reservoir volume.
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